ENERCOMP Seminar Series

Durability analysis of adhesive joints: advancements, challenges, and the path to implementation.

Thursday, August 14th, 2025



ABSTRACT

In recent decades, adhesive bonding has become a cornerstone of modern engineering, used extensively in industries such as aerospace, automotive, wind energy, and civil engineering. While bonded joints offer significant advantages over traditional fastening methods, ensuring their long-term durability remains a complex challenge. Factors such as fatigue, environmental aging, and multi-bonded configurations create significant barriers to the reliable prediction of service life in real-world structures.

Despite extensive research and the development of specialized models for fatigue and environmental degradation, translating this knowledge into practical design and maintenance workflows is still difficult. Current commercial software often lacks the integration of advanced durability models, leaving engineers to navigate a fragmented landscape of partial solutions. The situation becomes even more complicated in large or intricate structures with multiple bonded areas, where durability assessments must account for variable loads, temperature fluctuations, humidity, and long-term adhesive property changes.

This presentation provides a comprehensive review of durability analysis for adhesive joints, exploring the strengths and limitations of existing testing methods (e.g., strength, fracture, fatigue, and aging tests) and highlighting the difficulties in implementing these methods at scale. Special attention will be given to the challenge of balancing fatigue model accuracy with computational efficiency and the need for practical tools that engineers can easily use. By addressing these implementation challenges and encouraging closer collaboration between researchers and industry, we can move toward more robust, accessible, and reliable durability assessments for adhesive joints, ultimately enhancing the safety and longevity of bonded structures across a range of applications.

About the speaker