Oslo, Norway.

The ENERCOMP Technology Consortium is proud to announce a strong presence at the 22nd European Conference on Composite Materials (ECCM22), one of the world’s premier gatherings for the composites research and engineering community.

Throughout the conference, our researchers will present a diverse portfolio of pioneering work spanning structural health monitoring, advanced manufacturing, adhesion science, composite joining technologies, non-destructive testing (NDT), and smart sensing systems. These contributions reflect our continued commitment to advancing the reliability, durability, and intelligent monitoring of next-generation composite structures for energy, mobility, and industrial applications.

The conference program features multiple oral and poster presentations from ENERCOMP and MCEM researchers, highlighting innovative solutions to some of the most pressing challenges in composite engineering.

Monday, 22 June

Session 3.12 – Joining and Joints | 11:45

• Dr. Hassan Ejaz (ENERCOMP Postdoctoral Researcher)

  • Degradation of Semi-Structural Bell & Spigot GFRP Pipe Joint Integrity due to Air Pocket and Kissing Bond Defects

Session 1.11 – Other Application Domain | 12:45

• Dr. Syed Shah (ENERCOMP Postdoctoral Researcher)

  • Performance Assessment of Bell–Spigot Joints in GRP Pipelines with Kissing Bond Defects: Experiments and Modelling

Tuesday, 24 June

Poster Session | 15:15–16:30

• Dr. Asif Khan (ENERCOMP Track Leader)

  • Toward Reliable Rehabilitation: A Practical NDT Review for Composite Overwrap Damage Assessment

• Dr. Xiaole Li (MCEM Research Scientist)

  • Towards Reliable Interfacial Adhesion Testing in Fragile Thin-Film Devices

• Alaa M. Abdou (MCEM PhD Researcher)

  • Leveraging Processing-Induced Electromechanical Anisotropy of Laser-Induced Graphene for One-Shot Engraving of Highly Sensitive Strain Sensors

Thursday, 26 June

Special Session SS01 – Delaminations and Debonding in Composite Materials and Structures | 08:45

• Prof. Gilles Lubineau

  • Understanding the Role of Chemical Interactions and Mechanical Interlocking in the Adhesion of Electroplated Copper to ABS

Session 6.6 – Sensing and Actuation | 09:45

• Yupeng Shi (PhD Researcher)

  • Wireless Passive LC Sensors for Lifetime Condition Monitoring of Non-Metallic Joints

Special Session SS01 – Delaminations and Debonding in Composite Materials and Structures | 10:15

• Dr. Ahmed Wagih (ENERCOMP Track Leader)

  • Effect of Ply Thickness on Interlaminar Fracture Toughness of Thin-Ply Thermoplastic Composites

Session 7.12 – Structural Health Monitoring and Quality Control | 12:00

• Dr. Aldyandra Hami Seno (ENERCOMP Track Leader)

  • Capacitive IoT Strain Sensing System for Structural Health Monitoring of Nonmetallic Pipes

Driving Innovation Through Collaboration

The breadth of research presented at ECCM22 underscores the complementary strengths of ENERCOMP and MCEM in developing advanced composite technologies that address real-world industrial challenges. From improving joint integrity and damage assessment methodologies to enabling smart sensing and predictive monitoring capabilities, these contributions demonstrate how multidisciplinary research is shaping the future of composite structures.

ECCM22 also provides an invaluable platform for fostering new collaborations, exchanging ideas with international experts, and strengthening partnerships across academia and industry.

We look forward to engaging with colleagues from around the world and contributing to discussions that will drive the next generation of high-performance, intelligent, and sustainable composite systems.

If you are attending ECCM22, we invite you to join our presentations, visit our posters, and connect with our team to explore opportunities for collaboration and innovation.